IZMO stock surges 44% as izmomicro unveils groundbreaking high‑density silicon photonics packaging platform for industry.

• The platform supports 32‑channel fiber I/O with sub‑2 dB insertion loss, solving critical packaging challenges for data.
• Integrates 32 DC I/Os, 4 RF I/Os, delivering up to 70 GHz high‑speed RF performance across.
• Silicon photonics market projected $9 bn by 2030, driving AI, data‑center, 5G/6G growth, and global expansion.